Physical vapor deposition coating several main power supply
In the PVD coating technology used in the power source is varied, mainly include evaporation power, gun power, hollow cathode arc power supply, power supply, magnetron sputtering target power, heating power, bias power supply, etc. Mainly introduces the arc power supply, bias power supply and the characteristics of the magnetron sputtering target power.
Arc power source, arc ion plating, the realization of the target material evaporation and ionization must depend on arc power source to provide energy, in the actual process of coating, the power supply can automatically detect arcing phenomenon and automatic arc, ensure continuity and uniformity of the film coating process. In addition, the arc stability of arc power supply performance had a great influence on the performance of the film. Electric power supply is stable and reliable work is essential to the performance of the equipment. Arc power source has magnetic saturation amplifier type, thyristor, transistor switch type and high frequency inverter.
Bias power: it is mainly used for multi arc ion plating and magnetron sputtering deposition glow in the process of cleaning and ion bombardment and coating on the plating workpiece exert negative voltage. Glow when cleaning, vacuum chamber filled with argon gas, it produces glow; Ion bombardment is used to accelerate ions, improve the energy of the ion bombardment workpiece surface, enhance sputtering cleaning effect and increase the film adhesion; When coating, which is used to increase the ion energy, speed up the reaction deposition rate and improve the thin film growth, increase the film adhesion. As a result of the magnetron sputtering ionization rate is far lower than the multi arc ion plating, bias power supply the power needed to be smaller. But there are many coating machine is equipped with magnetron sputtering target, and also equipped with arc more target, selection bias power, to work in multi arc ion plating when asked to choose.
Target power magnetron sputtering ion plating: mainly used to provide electricity for magnetron sputtering target. It has a dc, single pulse, symmetrical bipolar pulse and double jacaranda pulse several forms.
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