The advantages of sputtering coating film
Sputtering vacuum coating method, because of its different coating methods, the effect of the same film coating material prepared will be different, although the naked eye can not see it, but it does have certain advantages. Film thickness, good stability, due to the sputtering target film thickness and discharge currents have a great relationship, the higher the current, the greater the sputtering eff...iciency, within the same time, the thickness of the coating layer is relatively big, as long as the current value of a good control, you need more than a thick plating, or more thin layers can be, of course, this thickness is within the allowable range, and control the current, regardless of how many times repeated plating, the film thickness is not will change the thickness of the film thickness can be attributed to the stability of good controllability and repeatability.
Film with strong, during the sputtering process, some electrons strike the substrate surface, and activating the surface atoms, and produce clean effect, the energy energy-plated material obtained by sputtering evaporation obtained higher than 1 when the two orders of magnitude, such a plating material having a high atomic impact energy to the substrate surface, more energy can be transferred to a substrate, produce more heat, so that the activation of atoms by electrons accelerated motion, and the part plated metal atom earlier fused together with each other, other plating material atom tight with successively deposited film, strengthening the binding force of the film and the substrate.
A wide range of plating material, due to sputtering by argon ion bombardment makes high speed plating material sputtered out, unlike Evaporation and restrictions due to the melting point of only using a relatively low melting point metal plating, sputtering and almost all the solid material can become coated material.
You can see from the above points Sputtering is indeed better than the evaporation vacuum coating effect, a different principle determines the thickness of the film is more stable sputtering, combined with stronger, broader-plated material.
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