Film, thin film coating on the vacuum introduction

Film, thin film coating on the vacuum introduction

Film: the film can be considered a two-dimensional material. In the strict academic sense, that only aggregate thickness is less than the thickness of the material characteristics of a real film, otherwise it is generally thin material. Characterized thickness: is the nature of the use of certain basic materials phenomenon will occur abnormal changes in the case of thin material thickness aggregation determined, i.e., when selected for a physical or mechanical properties different from the reference beginning to show it typically has a thickness characteristics when, is characterized in substance to the film thickness.

The main properties of the film：

Thickness: The more uniform the better, should generally be controlled within a range, such as 5, which is about the size of the workpiece coating system

Film surface morphology: transmission electron microscope by scanning electron microscopy (SEM) (TEM) analysis showed the like particle state, the availability of dense film surface, defect status, the annealing treatment on the membrane surface and other information.

Membrane organization features: X-ray diffraction analysis of the composition of the film, and other information available to the purity of the film. Film stress: the smaller the better films of internal stress, the internal pressure of the annealing process can maximize the release of the film.

Characteristics of the film and the substrate contact: mainly refers to the adhesion between the film and the substrate, of course, the stronger the better adhesion, the film appears to avoid missing the open and so on.

Dense membrane: mainly refers to film hardness and abrasion resistance, to avoid the open circuit external scratches caused.

Chemistry membrane, thermal stability: the requirements for the metal film layer of the metal film layer prepared resistivity as low as possible, close to the bulk resistivity.

Film analysis commonly used methods:

Scanning electron microscopy SEM analyzes 10nm resolution is generally more than surface information, sample preparation simple.

Transmission electron microscopy TEM analyzes structural information, resolution of less than 1 atom, sample preparation difficult.

XRD analysis of the structure is the information, but can not analyze micro-structure information for the film, XRD given direction, SEM choose a good area, TEM-depth analysis, which is a combination of boxing.