At present there are three kinds of commonly used PVD: vacuum evaporation, sputtering deposition and ion plating. They work as follows: really empty plating film is in 1.33 x10 ^ 3 and 1.33 x10 ^ - 4 under the pressure of pa, with heat source heating material such as electron beam evaporation, evaporation of atoms or molecules directly on the workpiece surface sediments. Sputtering coating: it is not the evaporation technology of physical vapor deposition method. When plating, the studio into a vacuum, into argon as working gas, and maintain its pressure is 0.13 to 1.33 Pa. Ion plating: is it under the condition of vacuum, the use of gas discharge so that gas or evaporation material ionization of evaporation in the gas ion or material under the action of ion bombardment, evaporation, material or other reactant vapor deposition on the workpiece.
Vacuum coating is mainly refers to a kind of need to be done under high vacuum coating, including many types, including vacuum ion evaporation, magnetron sputtering, MBE molecular beam epitaxy, laser sputtering deposition and so on many kinds of PLD. The main idea is divided into evaporation and sputtering.
Need coating known as substrate, the plating material is become a target. Substrate with target in the vacuum chamber.
Evaporation coating is to heat the surface of target component to groups of atoms, or ions form by evaporation, and sedimentation in the substrate surface, through the film-forming process (scatter - island structure - the vagus structure - layered growth) form the membrane. For sputtering coating, can be simple to understand for the use of electronic or high-energy laser bombardment of target, and the surface components form groups of atoms, or ions was sputtering, and eventually deposited on the substrate surface, experience the film-forming process, eventually form a thin film.
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